Lynx

"Llano" (32nm)

• All models support: SSE
  Streaming SIMD Extensions
  In computing, Streaming SIMD Extensions is a SIMD instruction set extension to the x86 architecture, designed by Intel and introduced in 1999 in their Pentium III series processors as a reply to AMD's 3DNow! . SSE contains 70 new instructions, most of which work on single precision floating point...
  
  , SSE2
  SSE2
  SSE2, Streaming SIMD Extensions 2, is one of the Intel SIMD processor supplementary instruction sets first introduced by Intel with the initial version of the Pentium 4 in 2001. It extends the earlier SSE instruction set, and is intended to fully supplant MMX. Intel extended SSE2 to create SSE3...
  
  , SSE3
  SSE3
  SSE3, Streaming SIMD Extensions 3, also known by its Intel code name Prescott New Instructions , is the third iteration of the SSE instruction set for the IA-32 architecture. Intel introduced SSE3 in early 2004 with the Prescott revision of their Pentium 4 CPU...
  
  , SSE4a, Enhanced 3DNow!
  3DNow!
  3DNow! is an extension to the x86 instruction set developed by Advanced Micro Devices . It adds single instruction multiple data instructions to the base x86 instruction set, enabling it to perform simple vector processing, which improves the performance of many graphic-intensive applications...
  
  , NX bit
  NX bit
  The NX bit, which stands for No eXecute, is a technology used in CPUs to segregate areas of memory for use by either storage of processor instructions or for storage of data, a feature normally only found in Harvard architecture processors...
  
  , AMD64, PowerNow!
  PowerNow!
  PowerNow! is speed throttling and power saving technology of AMD's processors used in laptops. The CPU's clock speed and VCore are automatically decreased when the computer is under low load or idle, to save battery power, reduce heat and noise...
  
  , AMD-V, Turbo Core
• Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel).
• ¹ Config GPU are Unified Shaders
  GPGPU
  General-purpose computing on graphics processing units is the technique of using a GPU, which typically handles computation only for computer graphics, to perform computation in applications traditionally handled by the CPU...
  
   (Vertex shader/Geometry shader/Pixel shader) : Texture mapping unit
  Texture mapping unit
  A texture mapping unit is a component in modern graphics processing units , historically it is a separate physical processor. A TMU is able to rotate and resize a bitmap to be placed onto an arbitrary plane of a given 3D object as a texture...
  
   : Render Output unit
  Render Output unit
  The Render Output Unit, often abbreviated as "ROP", and sometimes called Raster Operations Pipeline, is one of the final steps in the rendering process of modern 3D accelerator boards. The pixel pipelines take pixel and texel information and process it, via specific matrix and vector operations,...
  
  

  Model Number	| Step.	| CPU						| GPU			| Memory Support	| UMI	| TDP Thermal Design Power The thermal design power , sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat...	| Socket CPU socket A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board . This allows the CPU to be replaced without soldering....	| Release Date	| Part Number(s)
  		Cores	Freq.	Turbo	L2-Cache	Multi !! Voltage CPU core voltage The CPU core voltage is the power supply voltage supplied to the CPU , GPU, or other device containing a processing core...  !! Model !! Config1 !! Freq.
  A4-3305M	B0	2	1.9 GHz	2.5 GHz	2 × 1 MB	19x	0.9125 - 1.4125	HD 6480G	240:12:4	444 MHz?	DDR3-1333	2.5 GT/s	45 W	Socket FS1	Q4 2011
  A4-3320M	B0	2	2 GHz	2.6 GHz	2 × 1 MB	19x	0.9125 - 1.4125	HD 6480G	240:12:4	444 MHz	DDR3-1333	2.5 GT/s	45 W	Socket FS1	Q4 2011
  A4-3330MX	B0	2	2.4 GHz	2.6 GHz	2 × 1 MB	21x	0.9125 - 1.4125	HD 6480G	240:12:4	444 MHz	DDR3-1333	2.5 GT/s	45 W	Socket FS1	Q4 2011
  A6-3420M	B0	4	1.5 GHz	2.4 GHz	4 × 1 MB	14x	0.9125 - 1.4125	HD 6520G	320:16:8	400 MHz	DDR3-1333	2.5 GT/s	45 W	Socket FS1	Q4 2011
  A6-3430MX	B0	4	1.7 GHz	2.4 GHz	4 × 1 MB	16x	0.9125 - 1.4125	HD 6520G	320:16:8	400 MHz	DDR3-1600	2.5 GT/s	45 W	Socket FS1	Q4 2011
  A8-3520M	B0	4	1.6 GHz	2.5 GHz	4 × 1 MB	18x	0.9125 - 1.4125	HD 6620G	400:20:8	444 MHz	DDR3-1600	2.5 GT/s	45 W	Socket FS1	Q4 2011
  A8-3550MX	B0	4	2 GHz	2.7 GHz	4 × 1 MB	20x	0.9125 - 1.4125	HD 6620G	400:20:8	444 MHz	DDR3-1600	2.5 GT/s	45 W	Socket FS1	Q4 2011

"Zacate" (40 nm)

• All models support: SSE
  Streaming SIMD Extensions
  In computing, Streaming SIMD Extensions is a SIMD instruction set extension to the x86 architecture, designed by Intel and introduced in 1999 in their Pentium III series processors as a reply to AMD's 3DNow! . SSE contains 70 new instructions, most of which work on single precision floating point...
  
  , SSE2
  SSE2
  SSE2, Streaming SIMD Extensions 2, is one of the Intel SIMD processor supplementary instruction sets first introduced by Intel with the initial version of the Pentium 4 in 2001. It extends the earlier SSE instruction set, and is intended to fully supplant MMX. Intel extended SSE2 to create SSE3...
  
  , SSE3
  SSE3
  SSE3, Streaming SIMD Extensions 3, also known by its Intel code name Prescott New Instructions , is the third iteration of the SSE instruction set for the IA-32 architecture. Intel introduced SSE3 in early 2004 with the Prescott revision of their Pentium 4 CPU...
  
  , SSSE3
  SSSE3
  Supplemental Streaming SIMD Extensions 3 is a SIMD instruction set created by Intel and is the fourth iteration of the SSE technology.- History :...
  
  , SSE4a, NX bit
  NX bit
  The NX bit, which stands for No eXecute, is a technology used in CPUs to segregate areas of memory for use by either storage of processor instructions or for storage of data, a feature normally only found in Harvard architecture processors...
  
  , AMD64, PowerNow!
  PowerNow!
  PowerNow! is speed throttling and power saving technology of AMD's processors used in laptops. The CPU's clock speed and VCore are automatically decreased when the computer is under low load or idle, to save battery power, reduce heat and noise...
  
  , AMD-V
• All models use the BGA-413 CPU socket
  CPU socket
  A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board . This allows the CPU to be replaced without soldering....
  
  
• All models support single-channel DDR3 SDRAM
  DDR3 SDRAM
  In computing, DDR3 SDRAM, an abbreviation for double data rate type three synchronous dynamic random access memory, is a modern kind of dynamic random access memory with a high bandwidth interface. It is one of several variants of DRAM and associated interface techniques used since the early 1970s...
  
  , DDR3L SDRAM
• Config GPU are Unified Shaders
  GPGPU
  General-purpose computing on graphics processing units is the technique of using a GPU, which typically handles computation only for computer graphics, to perform computation in applications traditionally handled by the CPU...
  
   (Vertex shader/Geometry shader/Pixel shader) : Texture mapping unit
  Texture mapping unit
  A texture mapping unit is a component in modern graphics processing units , historically it is a separate physical processor. A TMU is able to rotate and resize a bitmap to be placed onto an arbitrary plane of a given 3D object as a texture...
  
   : Render Output unit
  Render Output unit
  The Render Output Unit, often abbreviated as "ROP", and sometimes called Raster Operations Pipeline, is one of the final steps in the rendering process of modern 3D accelerator boards. The pixel pipelines take pixel and texel information and process it, via specific matrix and vector operations,...
  
  

  Model Number	| Step.	| CPU						| GPU			| Memory Support	| UMI	| TDP Thermal Design Power The thermal design power , sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat...	| Socket CPU socket A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board . This allows the CPU to be replaced without soldering....	| Release Date	| Part Number
  		Cores	Freq.	Turbo	L2 Cache	Multi	Voltage CPU core voltage The CPU core voltage is the power supply voltage supplied to the CPU , GPU, or other device containing a processing core...	Model	Config	Freq.
  E-1200		2	1.4 GHz	rowspan="2"	2 × 512 KB	14×		HD 7310	80:8:4	500 MHz	DDR3-1066	2.5 GT/s	18 W	Socket FT1 (BGA-413)	Q1 2012
  E-1800			1.7 GHz	17×			HD 7340	523–680 MHz		DDR3-1333

"Desna" (40nm)

Opteron 3200 (32 nm, up to 8-core)

• All models support: MMX, SSE
  Streaming SIMD Extensions
  In computing, Streaming SIMD Extensions is a SIMD instruction set extension to the x86 architecture, designed by Intel and introduced in 1999 in their Pentium III series processors as a reply to AMD's 3DNow! . SSE contains 70 new instructions, most of which work on single precision floating point...
  
  , SSE2
  SSE2
  SSE2, Streaming SIMD Extensions 2, is one of the Intel SIMD processor supplementary instruction sets first introduced by Intel with the initial version of the Pentium 4 in 2001. It extends the earlier SSE instruction set, and is intended to fully supplant MMX. Intel extended SSE2 to create SSE3...
  
  , SSE3
  SSE3
  SSE3, Streaming SIMD Extensions 3, also known by its Intel code name Prescott New Instructions , is the third iteration of the SSE instruction set for the IA-32 architecture. Intel introduced SSE3 in early 2004 with the Prescott revision of their Pentium 4 CPU...
  
  , SSSE3
  SSSE3
  Supplemental Streaming SIMD Extensions 3 is a SIMD instruction set created by Intel and is the fourth iteration of the SSE technology.- History :...
  
  , SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES
  AES instruction set
  Advanced Encryption Standard Instruction Set is an extension to the x86 instruction set architecture for microprocessors from Intel and AMD proposed by Intel in March 2008...
  
  , CLMUL
  CLMUL instruction set
  Carry-less Multiplication is an extension to the x86 instruction set used by microprocessors from Intel and AMD which was proposed by Intel in March 2008 and made available in the Intel Westmere processors announced in early 2010. The purpose is to improve the speed of applications doing block...
  
  , AVX
  Advanced Vector Extensions
  Advanced Vector Extensions is an extension to the x86 instruction set architecture for microprocessors from Intel and AMD proposed by Intel in March 2008 and first supported by Intel with the Westmere processor shipping in Q1 2011 and now by AMD with the Bulldozer processor shipping in Q3 2011.AVX...
  
  , XOP
  XOP instruction set
  The XOP instruction set, announced by AMD on May 1, 2009, is an extension to the 128-bit SSE core instructions in the x86 and AMD64 instruction set for the Bulldozer processor core, which was released on October 12th, 2011....
  
  , FMA4, CVT16
  CVT16 instruction set
  The CVT16 instruction set, announced by AMD on May 1, 2009, is an extension to the 128-bit SSE core instructions in the x86 and AMD64 instruction set.CVT16 is a revision of part of the SSE5 instruction set proposal announced on August 30, 2007...
  
  .
• 4 AMD Bulldozer
  Bulldozer (processor)
  Bulldozer is the codename Advanced Micro Devices has given to one of the next-generation CPU cores after the K10 microarchitecture for the company's M-SPACE design methodology, with the core specifically aimed at 10-watt to 125-watt TDP computing products. Bulldozer is a completely new design...
  
   modules
• HyperTransport 3.1
• All models support Dual-Channel up to DDR3-1600 memory.
• Transistors: 1.2 billion
• Die
  Die (integrated circuit)
  A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon or other semiconductor through processes such as...
  
   size: 315 mm²

"Sepang" 4000 Series Opteron (32 nm

32 nanometer

The 32 nm process is the step following the 45 nanometer process in CMOS semiconductor device fabrication. 32 nanometer refers to the average half-pitch of a memory cell at this technology level...

 SOI

Silicon on insulator

Silicon on insulator technology refers to the use of a layered silicon-insulator-silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance and thereby improving performance...

, up to 10-core)

• Triple-Channel DDR3
• Integrated PCI Express 3.0
• Socket C2012

"Terramar" 6000 Series Opteron (32 nm SOI, up to 20-core)

• Quad-Channel DDR3
• Integrated PCI Express 3.0
• Socket G2012

"Macau" 4000 Series Opteron (28 nm high-k

High-k Dielectric

The term high-κ dielectric refers to a material with a high dielectric constant κ used in semiconductor manufacturing processes which replaces the silicon dioxide gate dielectric...

 or possibly 22 nm

22 nanometer

The 22 nanometer node is the CMOS process step following 32 nm. It was introduced by semiconductor companies in 2011. The typical half-pitch for a memory cell is around 22 nm...

 FDSOI

SOI MOSFET

In electronics, an SOI MOSFET semiconductor device is a Silicon on Insulator MOSFET structure in which a semiconductor layer, e.g. silicon, germanium or the like, is formed above an insulator layer which may be a buried oxide layer formed in a semiconductor substrate. SOI MOSFET devices are...

, up to 10-core)

• Triple-Channel DDR3
• Integrated PCI Express 3.0
• Socket C2012

"Dublin" 6000 Series Opteron (28 nm high-k or possibly 22 nm FDSOI, up to 20-core)

• Quad-Channel DDR3
• Integrated PCI Express 3.0
• Socket G2012

See also

• AMD K10
  AMD K10
  The AMD Family 10h is a microprocessor microarchitecture by AMD. Though there were once reports that the K10 had been canceled, the first third-generation Opteron products for servers were launched on September 10, 2007, with the Phenom processors for desktops following and launching on November...
  
  
• AMD Fusion
  AMD Fusion
  AMD Fusion is the marketing name for a series of APUs by AMD. There are two flavors of Fusion currently available, one with its CPU logic based on the Bobcat core and the other its CPU logic based on the 10h core. In both cases the GPU logic is HD6xxx, which itself is based on the mobile variant of...
  
  
• AMD Phenom
• AMD Turion
  AMD Turion
  AMD Turion is the brand name AMD applies to its 64-bit low-power consumption processors codenamed K8L. The Turion 64 and Turion 64 X2/Ultra processors compete with Intel's mobile processors, initially the Pentium M and the Intel Core and Intel Core 2 processors.-Features:Earlier Turion 64...
  
  
• List of AMD A microprocessors
• List of AMD FX microprocessors
• List of AMD Opteron microprocessors
• List of AMD Phenom microprocessors
• List of AMD Turion microprocessors
• List of AMD Athlon X2 microprocessors
• List of AMD Sempron microprocessors
• List of AMD mobile microprocessors
• List of AMD Fusion microprocessors
• List of AMD microprocessors
• List of future Intel microprocessors