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Thermal Design Power
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The Thermal Design Power (TDP) (sometimes called Thermal Design Point) represents the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 W TDP, which means that it can dissipate (either via an active cooling method such as a fan, a passive cooling method via natural convection, via heat radiation or all three modes of heat transfer) 20 watts of heat without exceeding the maximum junction temperature for the chip.

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The Thermal Design Power (TDP) (sometimes called Thermal Design Point) represents the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 W TDP, which means that it can dissipate (either via an active cooling method such as a fan, a passive cooling method via natural convection, via heat radiation or all three modes of heat transfer) 20 watts of heat without exceeding the maximum junction temperature for the chip. The TDP is typically not the most power the chip could ever draw (such as by a power virus), but rather the maximum power that it would draw when running real applications. This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power, which would cost more and achieve no real benefit.
Since the definition of "real applications" and the safety margins vary between manufacturers, TDP values between different manufacturers cannot be accurately compared. While a processor with a TDP of 100 W will almost certainly use more power at full load than a processor with a 10 W TDP, it may or may not use more power than a processor from a different manufacturer that has a 90 W TDP. Additionally, TDPs are often specified for families of processors, with the low-end models using significantly less power than those at the high end of the family.
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