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Wire Bonding

 
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Wire bonding is the primary method of making interconnections between an integrated circuit
Integrated circuit

In electronics, an integrated circuit is a miniaturized electronic circuit that has been manufactured in the surface of a thin Wafer of semiconductor material....
 (IC) and a printed circuit board
Printed circuit board

A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using Conductor pathways, or signal traces, industrial etchinged from copper sheets laminated onto a non-conductive substrate....
 (PCB) during semiconductor device fabrication.






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Wirebond Ballbond
Transistor Die Ksy34
Wire bonding is the primary method of making interconnections between an integrated circuit
Integrated circuit

In electronics, an integrated circuit is a miniaturized electronic circuit that has been manufactured in the surface of a thin Wafer of semiconductor material....
 (IC) and a printed circuit board
Printed circuit board

A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using Conductor pathways, or signal traces, industrial etchinged from copper sheets laminated onto a non-conductive substrate....
 (PCB) during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one PCB to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages.

Bondwires usually consist of one of the following materials:
  • Gold
    Gold

    Gold is a chemical element with the symbol Au and atomic number 79. It is a highly sought-after precious metal, having been used as money, as a store of value, in jewelry, in sculpture, and for ornamentation since the beginning of recorded history....
  • Aluminum
  • Copper
    Copper

    Copper is a chemical element with the symbol Cu and atomic number 29.It is a ductile metal with very high thermal and electrical conductivity....


Wire diameters start at 15 µm and can be up to several hundred micrometres for high-powered applications.

There are two main classes of wire bonding:
  • Ball bonding
    Ball bonding

    Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of Fabrication ....
  • Wedge bonding


Ball bonding usually is restricted to gold and copper wire and usually requires heat. Wedge bonding can use either gold or aluminum wire, with only the gold wire requiring heat.

In either type of wire bonding, the wire is attached at both ends using some combination of heat, pressure, and ultrasonic energy to make a weld
Welding

Welding is a fabrication or sculpture process that joins materials, usually metals or thermoplastics, by causing coalescence . This is often done by melting the workpieces and adding a filler material to form a pool of molten material that cools to become a strong joint, with pressure sometimes used in conjunction with heat, or by itself,...
.

See also


  • purple plague (intermetallic)
  • ball bonding
    Ball bonding

    Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of Fabrication ....
  • silver epoxy
    Silver epoxy

    Silver epoxy paste is a one component system designed as a conductive thermosetting silver preparation for screen printing applications. It is a screenable silver epoxy preparation for developing high quality electrical and mechanical contacts - used in bonding semiconductors and other devices in hybrid microelectronic circuits....
  • eutectic bonding process
    Eutectic bonding process

    Eutectic bonding process occurs when the substrate is secured on a heated workstage which operates at a temperature just below the eutectic melting point....
  • thermosonic bonding
    Thermosonic bonding

    Thermosonic bonding is an emerging, solderless technology for area-array connections, including flip chip. The thermosonic approach is used to join ICs with gold bumps to gold plated pads on substrate....
  • gold ribbon bonding
  • parallel gap welding
    Parallel gap welding

    Parallel gap welding is a special micro resistance welding process for joining thin foils or thin wires. The two electrodes are configured in parallel, having a gap between them in which insulation material is inserted....