Shrink Small-Outline Package
Encyclopedia
Shrink small-outline package (SSOP) is a microchip
package for surface-mount technology
. SSOP chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm).
The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package which is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with standard SOPs.
Applications for a SSOP enable end-products (pagers, portable audio/video, disc drives, radio, RF devices/components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon / GaAs technologies are well addressed by the SSOP product family.
Another version of the SSOP is the ExposedPad SSOP. The ExposedPad SOIC / SSOPs can increase heat dissipation by as much as 110% over standard packages, thereby expanding the margin of operating parameters.
Additionally, the ExposedPad can be connected to ground, thereby reducing loop inductance for high frequency applications. The ExposedPad should be soldered directly to the PCB to realize the thermal and electrical benefits.
Integrated circuit
An integrated circuit or monolithic integrated circuit is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material...
package for surface-mount technology
Surface-mount technology
Surface mount technology is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards . An electronic device so made is called a surface mount device...
. SSOP chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm).
The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package which is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with standard SOPs.
Applications for a SSOP enable end-products (pagers, portable audio/video, disc drives, radio, RF devices/components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon / GaAs technologies are well addressed by the SSOP product family.
Another version of the SSOP is the ExposedPad SSOP. The ExposedPad SOIC / SSOPs can increase heat dissipation by as much as 110% over standard packages, thereby expanding the margin of operating parameters.
Additionally, the ExposedPad can be connected to ground, thereby reducing loop inductance for high frequency applications. The ExposedPad should be soldered directly to the PCB to realize the thermal and electrical benefits.
See also
- PSOP Plastic Small-Outline Package
- TSOPThin small-outline packageThin small-outline packages, or TSOPs are a type of surface mount IC package. They are notably very low-profile and have tight lead spacing ....
Thin Small-Outline Package - TSSOPTSSOPA TSSOP is a rectangular, thin body size surface mount component. A Type I TSSOP has legs protruding from the width portion of the package. A Type II TSSOP has the legs protruding from the length portion of the package...
Thin-Shrink Small Outline Package - Chip carrierChip carrierA chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile chip to a circuit board. This connection may be...
Chip packaging and package types list
External links
- Amkor Technology SSOP package.
- Amkor Technology ExposedPad SOIC / SSOP package.
- Image of a 74HC4067 multiplexer chip in a SSOP package. A US quarterQuarter (United States coin)A quarter dollar, commonly shortened to quarter, is a coin worth ¼ of a United States dollar, or 25 cents. The quarter has been produced since 1796. The choice of 25¢ as a denomination, as opposed to 20¢ which is more common in other parts of the world, originated with the practice of dividing...
is shown for a size reference.