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Chip Carrier

 
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Chip carrier
 
 
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A chip carrier, also known as a chip container or chip package, is a container for an integrated circuit
Integrated circuit

In electronics, an integrated circuit is a miniaturized electronic circuit that has been manufactured in the surface of a thin Wafer of semiconductor material....
. The carrier usually provides metal
Metal

In chemistry, a metal is a chemical element whose atoms readily lose electrons to form positive ions , and form metallic bonds between other metal atoms and ionic bonds between nonmetal atoms....
 lead
Lead (electronics)

In electronics, a lead has two meanings:*An electrical connection consisting of a length of wire or soldering pad that comes from a device. Leads are used for physical support, to transfer power, to probe circuit , and to transmit information....
s, or "pins", which are sturdy enough to electrically and mechanically connect the fragile silicon
Silicon

Silicon is the most common metalloid. It is a chemical element, which has the symbol Si and atomic number 14. The atomic mass is 28.0855....
 microchip to a circuit board.






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Signetics Ne555n
A chip carrier, also known as a chip container or chip package, is a container for an integrated circuit
Integrated circuit

In electronics, an integrated circuit is a miniaturized electronic circuit that has been manufactured in the surface of a thin Wafer of semiconductor material....
. The carrier usually provides metal
Metal

In chemistry, a metal is a chemical element whose atoms readily lose electrons to form positive ions , and form metallic bonds between other metal atoms and ionic bonds between nonmetal atoms....
 lead
Lead (electronics)

In electronics, a lead has two meanings:*An electrical connection consisting of a length of wire or soldering pad that comes from a device. Leads are used for physical support, to transfer power, to probe circuit , and to transmit information....
s, or "pins", which are sturdy enough to electrically and mechanically connect the fragile silicon
Silicon

Silicon is the most common metalloid. It is a chemical element, which has the symbol Si and atomic number 14. The atomic mass is 28.0855....
 microchip to a circuit board. This connection may be made by soldering
Soldering

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a relatively low melting point....
 or by mechanical force
Force

In physics, a force is that which can cause an object with mass to change its velocity. Force has both Euclidean_vector#Length of a vector and Direction , making it a Vector quantity....
 applied by spring
Spring (device)

A spring is an Elasticity object used to store mechanical energy. Springs are usually made out of hardened steel. Small springs can be wound from pre-hardened stock, while larger ones are made from annealing steel and hardened after fabrication....
s or a ZIF socket. Most circuit boards today mount the chips on the surface
Surface-mount technology

Surface-mount technology is a method for constructing Electronics circuits in which the components are mounted directly onto the surface of printed circuit boards ....
 of the board, although previously it was common to place the pins in through-holes punched into the board. As smaller packages are cheaper and ecologically safer, most modern chip carriers are too small for practical installation by humans. Modern microprocessors may have over 1000 pins, so the integrated circuit packaging
Integrated circuit packaging

Integrated circuit packaging is the final stage of Fabrication per se, followed by IC testing.In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly....
 technology to manufacture and install the carrier must be very reliable.

Types of chip carriers

  • BGA
    Ball grid array

    A ball grid array is a type of surface-mount packaging used for integrated circuits....
    : Ball Grid Array
  • CPGA
    CPGA

    CPGA stands for Ceramic Pin Grid Array, a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with pins arranged in a pin grid array....
    : Ceramic Pin Grid Array
  • DIP
    Dual in-line package

    File:Three_IC_circuit_chips.JPGIn microelectronics, a dual in-line package , sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins....
    : Dual Inline Package (also known as PDIP)
  • FCPGA: Flip-chip Pin Grid Array
  • OPGA
    OPGA

    The Organic Pin Grid Array is a type of connection for integrated circuits, and especially Central processing unit, where the silicon Die is attached to a plate out of an organic compound plastic which is pierced by an array of pins which make the requisite connections to the CPU socket....
    : Organic Pin Grid Array
  • LGA
    Land grid array

    The land grid array is a type of surface-mount packaging used for integrated circuits. It can be electrically connected to a Printed circuit board either by the use of a CPU socket or by soldering directly to the PCB....
    : Land Grid Array
  • PGA
    Pin grid array

    A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging. In a PGA, the pins are arranged in a square array that may or may not cover the bottom of the package....
    : Pin Grid Array (also known as PPGA)
  • PLCC
    Plastic leaded chip carrier

    A Plastic Leaded Chip Carrier is a four-sided Lead plastic integrated circuit package with pin spacings of 0.05" . Lead counts range from 20 to 84....
    : Plastic Leaded Chip Carrier
  • PQFP: Plastic Quad Flat Pack
  • QFN
    QFN

    A QFN or Quad Flat No leads or a MLF package is an integrated circuit package which falls under Surface mount technology packages used on printed circuit boards....
    : Quad Flat No Leads
  • SOIC
    Small-Outline Integrated Circuit

    A small-outline integrated circuit is a Surface-mount technology integrated circuit package which occupies an area about 30 - 50% less than an equivalent dual in-line package, with a typical thickness that is 70% less....
    : Small-outline Integrated Circuit
  • SSOP
    Shrink Small-Outline Package

    Shrink small-outline package is a integrated circuit package for surface-mount technology. SSOP chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches ....
    : Shrink Small-Outline Package
  • TQFP
    TQFP

    Thin Quad Flat Pack is a type of Surface-mount_technology Surface-mount_technology#Package_sizes. Components of this type provide the same benefit of the metric QFP package, but are thinner and have a standard lead-frame footprint ....
    : Thin Quad Flat Pack
  • TSOP
    Thin small-outline package

    Thin small-outline packages, or TSOPs are a type of surface mount IC package. They are notably very low-profile and have tight lead spacing ....
    : Thin Small-outline Package


See Also

  • Integrated circuit packaging
    Integrated circuit packaging

    Integrated circuit packaging is the final stage of Fabrication per se, followed by IC testing.In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly....


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