Thin small-outline packages, or
TSOPs are a type of surface mount
ICIC or ic may stand for:In computing and technology:*.ic.gov is a second-level domain name administered by the US Government for members of the intelligence community*Integrated circuit*initial condition...
package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).
They are frequently used for RAM or Flash memory ICs dues to their high pin count and small volume. In some applications, they are being supplanted by
ball grid arrayA ball grid array is a type of surface-mount packaging used for integrated circuits.- Description :The BGA is descended from the pin grid array , which is a package with one face covered with pins in a grid pattern...
packages which can achieve even higher densities.
TSOPs are rectangular in shape and come in two varieties: Type I and Type II.
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Thin small-outline packages, or
TSOPs are a type of surface mount
ICIC or ic may stand for:In computing and technology:*.ic.gov is a second-level domain name administered by the US Government for members of the intelligence community*Integrated circuit*initial condition...
package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).
They are frequently used for RAM or Flash memory ICs dues to their high pin count and small volume. In some applications, they are being supplanted by
ball grid arrayA ball grid array is a type of surface-mount packaging used for integrated circuits.- Description :The BGA is descended from the pin grid array , which is a package with one face covered with pins in a grid pattern...
packages which can achieve even higher densities.
Physical properties
TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages.
Type I
| Part Number |
Pins |
Body Width/mm |
Body Length/mm |
Lead Pitch/mm |
| TSOP28 |
28 |
8.1 |
11.8 |
0.55 |
| TSOP28/32 |
28/32 |
8 |
18.4 |
0.5 |
| TSOP40 |
40 |
10 |
18.4 |
0.5 |
| TSOP48 |
48 |
12 |
18.4 |
0.5 |
| TSOP56 |
56 |
14 |
18.4 |
0.5 |
Type II
| Part Number |
Pins |
Body Width/mm |
Body Length/mm |
Lead Pitch/mm |
| TSOP20/24/26 |
20/24/26 |
7.6 |
17.14 |
1.27 |
| TSOP24/28 |
24/28 |
10.16 |
18.41 |
1.27 |
| TSOP32 |
32 |
10.16 |
20.95 |
1.27 |
| TSOP40/44 |
40/44 |
10.16 |
18.42 |
0.8 |
| TSOP50 |
50 |
10.16 |
20.95 |
0.8 |
| TSOP54 |
54 |
10.16 |
22.22 |
0.8 |
| TSOP66 |
66 |
10.16? |
22.22 |
0.65 |
Similar packages
There are a variety of small form-factor IC carrier available other than TSOPs
- Small-outline integrated circuit
A small-outline integrated circuit is a surface-mounted integrated circuit package which occupies an area about 30-50% less than an equivalent DIP, with a typical thickness that is 70% less. They are generally available in the same pinouts as their counterpart DIP ICs...
(SOIC)
- Plastic small-outline package (PSOP)
- Shrink small-outline package
Shrink small-outline package is a microchip package for surface-mount technology. SSOP chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches ....
(SSOP)
- TSSOP
A TSSOP is a four-sided, rectangular, thin body size surface mount component. A Type I TSSOP has leads protruding from the width portion of the package. A Type II TSSOP has the leads protruding from the length portion of the package...
Thin-shrink small outline package
See also
- Integrated circuit
In electronics, an integrated circuit is a miniaturized electronic circuit that has been manufactured in the surface of a thin substrate of semiconductor material...
- Chip carrier
A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile silicon microchip to a circuit board...
Chip packaging and package types list
External links