Flip-chip pin grid array
Encyclopedia
Flip-chip
pin grid array (FC-PGA or FCPGA) is a form of pin grid array
integrated circuit packaging
in which the die
faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other cooling mechanism.
The FC-PGA package and its variants are used on certain Intel Celeron
, Pentium III
, and Pentium 4
family microprocessor
s. FC-PGA processors fit into zero insertion force (ZIF) Socket 370
and Socket 478
motherboard socket
s; similar packages have also been used by AMD.
Flip chip
Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and Microelectromechanical systems , to external circuitry with solder bumps that have been deposited onto the chip pads...
pin grid array (FC-PGA or FCPGA) is a form of pin grid array
Pin grid array
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or roughly square, and the pins are arranged in a regular array on the underside of the package...
integrated circuit packaging
Integrated circuit packaging
Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the electrical contacts required to assemble the integrated circuit into a system.In the integrated...
in which the die
Die (integrated circuit)
A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon or other semiconductor through processes such as...
faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other cooling mechanism.
The FC-PGA package and its variants are used on certain Intel Celeron
Celeron
Celeron is a brand name given by Intel Corp. to a number of different x86 computer microprocessor models targeted at budget personal computers....
, Pentium III
Pentium III
The Pentium III brand refers to Intel's 32-bit x86 desktop and mobile microprocessors based on the sixth-generation P6 microarchitecture introduced on February 26, 1999. The brand's initial processors were very similar to the earlier Pentium II-branded microprocessors...
, and Pentium 4
Pentium 4
Pentium 4 was a line of single-core desktop and laptop central processing units , introduced by Intel on November 20, 2000 and shipped through August 8, 2008. They had a 7th-generation x86 microarchitecture, called NetBurst, which was the company's first all-new design since the introduction of the...
family microprocessor
Microprocessor
A microprocessor incorporates the functions of a computer's central processing unit on a single integrated circuit, or at most a few integrated circuits. It is a multipurpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and...
s. FC-PGA processors fit into zero insertion force (ZIF) Socket 370
Socket 370
Socket 370 is a common format of CPU socket first used by Intel for Pentium III and Celeron processors to replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of pin holes in the socket for CPU pins...
and Socket 478
Socket 478
Socket 478 is a 478-contact CPU socket used for Intel's Pentium 4 and Celeron series CPUs.Socket 478 was launched with the Northwood core to compete with AMD's 462-pin Socket A and their Athlon XP processors. Socket 478 was intended to be the replacement for Socket 423, a Willamette-based...
motherboard socket
CPU socket
A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board . This allows the CPU to be replaced without soldering....
s; similar packages have also been used by AMD.
See also
- CPGACPGACPGA stands for Ceramic Pin Grid Array, a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with pins arranged in a pin grid array. Some CPUs that use CPGA packaging are the AMD Socket A Athlons and the Duron....
- OPGAOPGAThe Organic Pin Grid Array is a type of connection for integrated circuits, and especially CPUs, where the silicon die is attached to a plate out of an organic plastic which is pierced by an array of pins which make the requisite connections to the socket.A popular type of CPU to employ the OPGA...
- Pin grid arrayPin grid arrayA pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or roughly square, and the pins are arranged in a regular array on the underside of the package...
- Wikihowto: Guide to IC packages
- Intel CPU Processor Identification
- Chip carrierChip carrierA chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile chip to a circuit board. This connection may be...
Chip packaging and package types list