Disco Corporation
Encyclopedia
is a precision tools maker from Japan
. The company was founded as Daiichi-Seitosho Co. Ltd. in May 1937, as an industrial abrasive wheels manufacturer.
In December 1968, it developed and released an ultra-thin resinoid cutting wheel, MICRON-CUT. As the cutting equipment at the time often caused damage to the abrasive wheels, the corporation moved into the market, releasing an automatic scriber
and dicing saw
in April 1975.
The company adopted the name of DISCO Corporation in May 1977, was listed with the Japan Securities Dealers' Association in October 1989, and entered the First Section of the Tokyo Stock Exchange
in December 1999.
DISCO Corporation makes dicing saws and laser saws to cut semiconductor
silicon wafers and other materials; grinders
to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
Japan
Japan is an island nation in East Asia. Located in the Pacific Ocean, it lies to the east of the Sea of Japan, China, North Korea, South Korea and Russia, stretching from the Sea of Okhotsk in the north to the East China Sea and Taiwan in the south...
. The company was founded as Daiichi-Seitosho Co. Ltd. in May 1937, as an industrial abrasive wheels manufacturer.
In December 1968, it developed and released an ultra-thin resinoid cutting wheel, MICRON-CUT. As the cutting equipment at the time often caused damage to the abrasive wheels, the corporation moved into the market, releasing an automatic scriber
Scriber
A scriber is a hand tool used in metalworking to mark lines on workpieces, prior to machining. The process of using a scriber is called scribing and is just part of the process of marking out. It is used instead of pencils or ink lines, because the marks are hard to see, easily erased, and...
and dicing saw
Dicing saw
A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire to dice, cut, or groove semiconductor wafers, silicon, glass, ceramic, crystal, and many other types of material....
in April 1975.
The company adopted the name of DISCO Corporation in May 1977, was listed with the Japan Securities Dealers' Association in October 1989, and entered the First Section of the Tokyo Stock Exchange
Tokyo Stock Exchange
The , called or TSE for short, is located in Tokyo, Japan and is the third largest stock exchange in the world by aggregate market capitalization of its listed companies...
in December 1999.
DISCO Corporation makes dicing saws and laser saws to cut semiconductor
Semiconductor
A semiconductor is a material with electrical conductivity due to electron flow intermediate in magnitude between that of a conductor and an insulator. This means a conductivity roughly in the range of 103 to 10−8 siemens per centimeter...
silicon wafers and other materials; grinders
Grinding machine
A grinding machine, often shortened to grinder, is a machine tool used for grinding, which is a type of machining using an abrasive wheel as the cutting tool...
to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.