Mobile Industry Processor Interface
Encyclopedia
The Mobile Industry Processor Interface (MIPI®) Alliance is an open membership organization that includes leading companies in the mobile industry that share the objective of defining and promoting open specifications for interfaces inside mobile terminals.
Formed in July 2003 by Intel, Nokia
, Samsung
, STMicroelectronics
and Texas Instruments
, MIPI aims to shave complexity and costs while boosting flexibility for cell phones and the chips that drive them.
MIPI has several working groups:
The working groups strive to define common standards.
Formed in July 2003 by Intel, Nokia
Nokia
Nokia Corporation is a Finnish multinational communications corporation that is headquartered in Keilaniemi, Espoo, a city neighbouring Finland's capital Helsinki...
, Samsung
Samsung
The Samsung Group is a South Korean multinational conglomerate corporation headquartered in Samsung Town, Seoul, South Korea...
, STMicroelectronics
STMicroelectronics
STMicroelectronics is an Italian-French electronics and semiconductor manufacturer headquartered in Geneva, Switzerland.While STMicroelectronics corporate headquarters and the headquarters for EMEA region are based in Geneva, the holding company, STMicroelectronics N.V. is registered in Amsterdam,...
and Texas Instruments
Texas Instruments
Texas Instruments Inc. , widely known as TI, is an American company based in Dallas, Texas, United States, which develops and commercializes semiconductor and computer technology...
, MIPI aims to shave complexity and costs while boosting flexibility for cell phones and the chips that drive them.
MIPI has several working groups:
- Battery Interface (BIF) Working Group
- Camera Working Group
- DigRFDigRF V3The DigRF working group was formed as a MIPI Alliance working group in April 2007. The group is focused on developing specifications for wireless mobile RFIC to base-band IC interfaces in mobile devices....
(interconnect between the RFIC and the baseband BBIC) - Display Working Group (defined Display Serial InterfaceDisplay Serial InterfaceThe Display Serial Interface is a specification by the Mobile Industry Processor Interface Alliance aimed at reducing the cost of display sub-systems in a mobile device. This is commonly targeted at LCD and similar display technologies...
) - High-Speed Synchronous Interface (HSI) Working Group
- Low Latency Interface (LLI) Working Group
- Low-Speed Multipoint Link (LML) Working Group (defined Serial Low-power Inter-chip Media Bus, SLIMbusSLIMbusThe Serial Low-power Inter-chip Media Bus is a standard interface between baseband or application processors and peripheral components in mobile terminals. It was developed within the MIPI® Alliance, ARM, Nokia, STMicroelectronics and Texas Instruments...
) - NAND Software Working Group
- Peripheral and interconnect Low-level Framework Working Group
- Physical (PHYPHYPHY is an abbreviation for the physical layer of the OSI model.An instantiation of PHY connects a link layer device to a physical medium such as an optical fiber or copper cable. A PHY device typically includes a Physical Coding Sublayer and a Physical Medium Dependent layer. The PCS encodes and...
) Layer Working Group - RF Front-End Control Working Group
- Software Working Group
- System Power Management Working Group
- Debug Working Group
- UniProSMUniProUniProSM is a high-speed interface technology for interconnecting integrated circuits in mobile phones or comparable products...
Working Group (high speed interconnect; also defines the UniPro protocol stackUniPro protocol stackIn mobile-telephone technology, the UniPro protocol stack follows the architecture of the classical OSI Reference Model. In UniPro, the OSI Physical Layer is split into two sublayers: Layer 1 and Layer 1.5 which abstracts from differences between alternative Layer 1 technologies...
)
The working groups strive to define common standards.