Micro-FCBGA
Encyclopedia
Micro-FCBGA is Intel's current BGA
mounting method for mobile processors that use a flip chip
binding technology. It was introduced with the Coppermine Mobile Celeron and replaces the older BGA2 ball-grid-array mounting method used in the Coppermine Pentium III mobile CPUs. Micro-FCBGA has 479 balls that are 0.78 mm in diameter and arranged similarly to the pins in a pin grid array
. The processor is affixed to the motherboard by soldering the balls to the motherboard. This allows for a much thinner CPU/interface profile than a pin grid array socket arrangement, but the micro-FCBGA chip is not removable from the motherboard. Micro-FCBGA is commonly used to mount ultra-low-voltage and low-voltage versions of mobile CPUs to the motherboard, likely due to its much thinner profile fitting better in the very thin sub-notebooks that those CPUs are usually used in. However, standard-voltage versions of the CPUs also occasionally use a micro-FCBGA interface instead of a pin grid array socket.
Ball grid array
A ball grid array is a type of surface-mount packaging used for integrated circuits.- Description :The BGA is descended from the pin grid array , which is a package with one face covered with pins in a grid pattern. These pins conduct electrical signals from the integrated circuit to the printed...
mounting method for mobile processors that use a flip chip
Flip chip
Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and Microelectromechanical systems , to external circuitry with solder bumps that have been deposited onto the chip pads...
binding technology. It was introduced with the Coppermine Mobile Celeron and replaces the older BGA2 ball-grid-array mounting method used in the Coppermine Pentium III mobile CPUs. Micro-FCBGA has 479 balls that are 0.78 mm in diameter and arranged similarly to the pins in a pin grid array
Pin grid array
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or roughly square, and the pins are arranged in a regular array on the underside of the package...
. The processor is affixed to the motherboard by soldering the balls to the motherboard. This allows for a much thinner CPU/interface profile than a pin grid array socket arrangement, but the micro-FCBGA chip is not removable from the motherboard. Micro-FCBGA is commonly used to mount ultra-low-voltage and low-voltage versions of mobile CPUs to the motherboard, likely due to its much thinner profile fitting better in the very thin sub-notebooks that those CPUs are usually used in. However, standard-voltage versions of the CPUs also occasionally use a micro-FCBGA interface instead of a pin grid array socket.