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Via (electronics)
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In printed circuit board design, via refers to a pad with a plated hole that connects copper tracks from one layer of the board to other layer(s). The holes are electroplated, filled with annular rings, or small rivets are inserted. High-density multi-layer PCBs may have microvias: so-called blind vias, which are exposed only on one outer layer, or buried vias, which not exposed on any outer layer. "Thermal vias" carry heat away from power devices.

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In printed circuit board design, via refers to a pad with a plated hole that connects copper tracks from one layer of the board to other layer(s). The holes are electroplated, filled with annular rings, or small rivets are inserted. High-density multi-layer PCBs may have microvias: so-called blind vias, which are exposed only on one outer layer, or buried vias, which not exposed on any outer layer. "Thermal vias" carry heat away from power devices. They are typically used in arrays of about a dozen vias.
In integrated circuit design, a via is a small opening in an insulating oxide layer that allows metallic interconnect on different interconnect layers to form a connection. A via on an integrated circuit is often called a through-chip via.
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