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Solid Logic Technology

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	Topics Solid Logic Technology Topic Home Solid Logic Technology (SLT) was IBMIBM company_name = International Business Machines Corporation \|... 's method for packaging electronic circuitry introduced in 1964 with the IBM System/360System/360 The IBM System/360 is a mainframe computer system family announced by IBM on April 7, 1964.... series and related machines. IBM chose to design custom hybrid circuitHybrid circuit An electronic circuit consisting of several different levels of components; printed circuits, semiconductors, resistors, capacitor... s using discrete, flip chipFlip chip A flip chip is one type of mounting used for semiconductor devices, such as IC chips, which does not require any wire bonds.... -mounted, glassGlass Glass is a uniform amorphous solid material, usually produced when the viscous molten material cools very rapidly to below i... -encapsulated transistorTransistor The transistor is a three terminal solid state semiconductor device that can be used for amplification, switching, voltage s... s and diodeDiode In electronics, a diode is a component that restricts the direction of movement of charge carriers.... s, with silk screenedScreen-printing Screenprinting, or serigraphy, previously known as Silkscreen is a printmaking technique that traditionally crea... resistorResistor \|- align = "center"\|\|width = "25"\|\| \|- align = "center"... s on a ceramicCeramic The word *ceramic* is derived from the Greek word ?e?a???? .... substrate. The circuits were either encapsulated in plastic or covered with a metal lid. Several of these were then mounted on a small multi-layer printed circuitPrinted circuit Printed circuit may refer to:* Printed circuit board... board to make an SLT module. Each SLT module had a socket on one edge that plugged into pins on the computer's backplane (the exact reverse of how most other company's modules were mounted). SLT was a revolutionary technology for 1964 with the reliability improvements over other assembly techniques helping propel the IBM/360 mainframe family to overwhelming success during the 1960s. SLT research produced ball chip assembly, wafer bumping, trimmed thick film resistors, printed discrete functions, chip capacitors and one of the first volume uses of hybrid thick film technology. SLT replaced the earlier Standard Modular SystemStandard Modular System The Standard Modular System was a system of standard transistorized circuit boards and mounting racks developed by IBM in th... . Later developments The same basic packaging technology (both device and module) was also used for the devices that replaced SLT as IBM gradually transitioned from hybrid integrated circuits to monolithic integrated circuits: Solid Logic Dense (SLD) increased packaging density and circuit performance by mounting the discrete transistors and diodes on top of the substrate and the resistors on the bottom. Advanced Solid Logic Technology (ASLT) increased packaging density and circuit performance by stacking two substrates in the same package. Monolithic System Technology (MST) increased packaging density and circuit performance by replacing discrete transistors and diodes with one to four monolithic integrated circuits (resistors now external from the package on the module). Trivia SLT was "rumoured" to be a core technology of the (then forthcoming) Xbox 360 games console after a spoof submission to the popular SlashdotSlashdot Slashdot is a technology-related news website which features user-submitted and editor-evaluated current affairs news with ... tech site claimed as such. s such.