Random access memory
Random-access memory refers to
data storage formats and equipment that allow the storing data to be accessed in any order — that is, at random, not just in sequence. In contrast, other types of memory devices can access data on the storage medium only in a predetermined order due to constraints in their mechanical design.
Generally, RAM in a computer is considered
main memory : the working area used for loading, displaying and manipulating applications and data. This type of RAM is usually in the form of
integrated circuits .
Encyclopedia
Random-access memory refers to
data storage formats and equipment that allow the storing data to be accessed in any order — that is, at random, not just in sequence. In contrast, other types of memory devices can access data on the storage medium only in a predetermined order due to constraints in their mechanical design.
Generally, RAM in a computer is considered
main memory : the working area used for loading, displaying and manipulating applications and data. This type of RAM is usually in the form of
integrated circuits . These are commonly called
memory sticks or
RAM sticks because they are manufactured as small
circuit boards with plastic packaging and are about the size of a few sticks of gum. Most
personal computers have slots for adding and replacing memory chips.
Most RAM can be both written to and read from, so "RAM" is often used interchangeably with "read-write memory." In this sense, RAM is the opposite of Sequential Access Memory.
Overview
Computers use RAM to hold the program code and data during computation. A defining characteristic of RAM is that all memory locations can be accessed at almost the same speed. Most other technologies have inherent delays for reading a particular bit or byte.
History
Early main memory systems built from
vacuum tubes behaved much like modern RAM, except that they failed frequently.
Core memory, which used wires attached to small ferrite electromagnetic cores, also had roughly equal access time. The term “core” is still used by some programmers to describe the RAM main memory of a computer. The basic concepts of tube and core memory are used in modern RAM implemented with
integrated circuits.
RAM Infomation
Alternative primary storage mechanisms usually involved a non-uniform delay for memory access.
Delay line memory used a sequence of
sound wave pulses in mercury-filled tubes to hold a series of bits.
Drum memory acted much like the modern
hard disk, storing data
magnetically in continuous circular bands.
Many types of RAM are
volatile, which means that unlike some other forms of computer storage such as disk storage and
tape storage, they lose all data when the computer is powered down. Modern RAM generally stores a bit of data as either a charge in a
capacitor, as in
dynamic RAM, or the state of a
flip-flop, as in
static RAM.
Currently, several types of
non-volatile RAM are under development, which will preserve data while powered down. The technologies used include
carbon nanotubes and magnetic tunnel effect.
In summer 2003, a 128 kB Magnetic RAM chip was introduced, which was manufactured with 0.18 µm technology. The core technology of MRAM is based on the magnetic tunnel effect. In June of 2004,
Infineon Technologies unveiled a 16 MB prototype based on 0.18 µm technology once again.
As for carbon nanotube memory, a high-tech startup built a functioning prototype 10 GB array in 2004.
Software can "partition" a portion of a computer's RAM, allowing it to act as a much-faster
hard drive, which is referred to as a RAM disk. Unless the memory used is non-volatile, a RAM disk does not maintain the stored data if the computer is shut down.
Some types of RAM can detect or correct random unintentional faults called
memory errors in the stored data .
The Memory Wall
The term "memory wall", first officially coined in , refers to the growing disparity between CPU and memory speed. From 1986 to 2000,
CPU speed improved at an annual rate of 55% while memory speed only improved at 10%. Given these trends, it was expected that memory latency would become an overwhelming
bottleneck in computer performance.
Currently, CPU speed improvements have slowed significantly partly due to major physical barriers and partly because we have already hit the memory wall in some sense. Intel summarized these causes in their [ftp://download.intel.com/technology/computing/archinnov/platform2015/download/Platform_2015.pdf Platform 2015 documentation ]: "First of all, as chip geometries shrink and clock frequencies rise, the transistor leakage current increases, leading to excess power consumption and heat . Intel's new could solve this problem. Secondly, the advantages of higher clock speeds are in part negated by memory latency, since memory access times have not been able to keep pace with increasing clock frequencies. Third, for certain applications, traditional serial architectures are becoming less efficient as processors get faster , further undercutting any gains that frequency increases might otherwise buy. In addition, resistance-capacitance delays in signal transmission are growing as feature sizes shrink, imposing an additional bottleneck that frequency increases don't address."
The RC delays in signal transmission were also noted in which projects a maximum of 12.5% average annual CPU performance improvement between 2000 and 2014. The data on clearly shows a slowdown in performance improvements in recent processors. However Intel's new processors, Core 2 shows a significant improvement over previous Pentium 4 processors.
Shadow RAM
Shadow RAM is RAM whose contents are copied from
read-only memory to allow shorter access times , as ROM is in general slower than RAM. The original ROM is disabled and the new location on the RAM is write-protected. This process is called
shadowing.
RAM packaging
General RAM packaging formats
Semiconductor RAM is produced as
integrated circuits or commonly RAM chips. RAM chips are often assembled into plug-in modules. Some standard module types are:
- RAM chip
- RAM modules
- Single In-line Pin Package
- Single in-line memory module
- Dual in-line memory module
- Rambus modules are technically DIMMs, but are usually referred to as RIMMs due to their proprietary slot.
- Small outline DIMM . Smaller version of the DIMM, used in laptops. Comes in versions with:
- 72 pins
- 144 pins
- 200 pins
- Small outline RIMM . Smaller version of the RIMM, used in laptops.
- Stacked v. non-stacked RAM modules
- Stacked RAM chips use two RAM wafers that are stacked on top of each other. This allows large module to be manufactured using cheaper low density wafers. Stacked chip modules draw more power.
Common RAM modules
Common RAM packages as illustrated to the right, from top to bottom:
- DIP 16-pin
- SIPP
- SIMM 30-pin
- SIMM 72-pin
- DIMM 168-pin
- DIMM 184-pin
- DIMM 240-pin
History of RAM modules used in PCs
An interactive application to learn more about RAM.
RAM manufacturers
Major manufacturers of semiconductor RAM as of 2006:
See also
External links
- – From searchMobileComputing.com
- – From Darrell's Computer Help and Information
- – Article by Jeff Tyson and Dave Coustan
- – From RAM
-
- – From Kingston
