The IEEE Components, Packaging, and Manufacturing Technologies Award is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components

Electronic component

An electronic component is a basic electronic element and may be available in a discrete form having two or more electrical terminals . These are intended to be connected together, usually by soldering to a printed circuit board, in order to create an electronic circuit with a particular function...

, electronic packaging

Electronic packaging

Electronic packaging is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to enclosures and protective features built into the product itself, and not to shipping containers...

 or manufacturing

Manufacturing

Manufacturing is the use of machines, tools and labor to produce goods for use or sale. The term may refer to a range of human activity, from handicraft to high tech, but is most commonly applied to industrial production, in which raw materials are transformed into finished goods on a large scale...

 technologies.

The award may be presented to an individual or a team of up to three recipients.

Recipients of this award receive a bronze medal, certificate and an honorarium

Honorarium

An honorarium is an ex gratia payment made to a person for their services in a volunteer capacity or for services for which fees are not traditionally required. This is used by groups such as schools or sporting clubs to pay coaches for their costs...

.

Recipients

Recipients of the award for each year include:

• 2004: John W. Balde
• 2005: Yutaka Tsukada
• 2006: C. P. Wong
• 2007: Dimitry Grabbe
• 2008: Karl Puttlitz
• 2008: Paul A. Totta

• 2009: George G. Harman
• 2010: Herbert Reichl
• 2011: Rao R. Tummala
• 2012: Mauro Walker

External links

• Information on the award at IEEE