HARMST
Encyclopedia
HARMST is an acronym for High Aspect Ratio Microstructure Technology that describes fabrication technologies,
used to create high-aspect-ratio
Aspect ratio
The aspect ratio of a shape is the ratio of its longer dimension to its shorter dimension. It may be applied to two characteristic dimensions of a three-dimensional shape, such as the ratio of the longest and shortest axis, or for symmetrical objects that are described by just two measurements,...

 microstructures with heights between tens of micrometers up to a centimeter and aspect ratios
Aspect ratio
The aspect ratio of a shape is the ratio of its longer dimension to its shorter dimension. It may be applied to two characteristic dimensions of a three-dimensional shape, such as the ratio of the longest and shortest axis, or for symmetrical objects that are described by just two measurements,...

 greater than 10:1. Examples include the LIGA
LIGA
LIGA is a German acronym for Lithographie, Galvanoformung, Abformung that describes a fabrication technology used to create high-aspect-ratio microstructures.-Overview:...

 fabrication process, advanced silicon etch
Advanced Silicon Etch
Advanced Silicon Etch is a deep reactive ion etching technique to rapidly etch deep and high aspect ratio structures in silicon.ASE was pioneered by Surface Technology Systems Plc. in 1994 in the UK...

, and deep reactive ion etching
Deep reactive ion etching
Deep reactive-ion etching is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios...

.

See also

  • LIGA
    LIGA
    LIGA is a German acronym for Lithographie, Galvanoformung, Abformung that describes a fabrication technology used to create high-aspect-ratio microstructures.-Overview:...

  • Advanced Silicon Etch
    Advanced Silicon Etch
    Advanced Silicon Etch is a deep reactive ion etching technique to rapidly etch deep and high aspect ratio structures in silicon.ASE was pioneered by Surface Technology Systems Plc. in 1994 in the UK...

  • Deep Reactive Ion Etching
    Deep reactive ion etching
    Deep reactive-ion etching is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios...

  • Micromechanical Systems — High Aspect Ratio (HAR) Micromachining
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