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Dual in Line Package

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Dual in-line package



 
 
In microelectronics
Microelectronics

Microelectronics is a subfield of electronics. Microelectronics, as the name suggests,is related to the study and manufacture, or microfabrication, of electronic components which are very small ....
, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted
Through-hole technology

File:Resistors .jpgThrough-hole technology, also spelled "thru-hole", refers to the mounting scheme used for Pin-through-hole electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldering to pads on the opposite side....
 to a printed circuit board
Printed circuit board

A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using Conductor pathways, or signal traces, industrial etchinged from copper sheets laminated onto a non-conductive substrate....
 (PCB), i.e.






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Dip Sockets
In microelectronics
Microelectronics

Microelectronics is a subfield of electronics. Microelectronics, as the name suggests,is related to the study and manufacture, or microfabrication, of electronic components which are very small ....
, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted
Through-hole technology

File:Resistors .jpgThrough-hole technology, also spelled "thru-hole", refers to the mounting scheme used for Pin-through-hole electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldering to pads on the opposite side....
 to a printed circuit board
Printed circuit board

A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using Conductor pathways, or signal traces, industrial etchinged from copper sheets laminated onto a non-conductive substrate....
 (PCB), i.e. to pass through holes on the PCB and be soldered
Soldering

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a relatively low melting point....
 on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase "DIP package" is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device(s), and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only an IC package of the former description (with bent leads at the sides.) A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. The photograph at the upper right shows three DIP14 ICs.

Applications


Types of devices


DIPs may be used for semiconductor integrated circuit
Integrated circuit

In electronics, an integrated circuit is a miniaturized electronic circuit that has been manufactured in the surface of a thin Wafer of semiconductor material....
s (ICs, "chips"), like logic gates, analog circuits, and microprocessor
Microprocessor

A microprocessor incorporates most or all of the functions of a central processing unit on a single integrated circuit . The first microprocessors emerged in the early 1970s and were used for electronic calculators, using Binary-coded decimal arithmetic on 4-bit Word ....
s, which is by far their most common use. They may also be used for other types of devices including arrays of discrete components such as resistors (often called
resistor packs), arrays of miniature rocker or slide switches known as DIP switch
DIP switch

A DIP switch is a set of manual Switch that are packaged in a group in a standard dual in-line package . This type of switch is designed to be used on a printed circuit board along with other electronics components and is commonly used to customize the behavior of an electronic device for specific situations....
es, various LED
Light-emitting diode

A light-emitting diode , is an electronic light source. The LED was discovered in the early 20th century, and introduced as a practical electronic component in 1962....
 arrays including segmented and bargraph displays and light bars, miniature rotary encoder
Rotary encoder

A rotary encoder, also called a shaft encoder, is an electro-mechanical device used to convert the angle position of a shaft or axle to an analog or digital code, making it an angle transducer....
 switches, and electromechanical relay
Relay

A relay is an electrical switch that opens and closes under the control of another electrical circuit. In the original form, the switch is operated by an magnet to open or close one or many sets of contacts....
s. Integrated circuits and resistor arrays usually have bent leads which extend from the sides of the package and turn to point downward; the IC packages tend to be black, and DIP resistor networks tend to be dark yellow or white plastic. The other types of DIP components, particularly LED devices, usually have completely straight pins (leads) extending directly from the bottom/back of the package, which is usually molded plastic and can be any color.

DIP plugs for ribbon cable, to connect to DIP sockets, have also been made (and can be found in some Apple II computers, as well as on some electronics test equipment used by technicians.) Dallas Semiconductor manufactured integrated DIP real-time clock (RTC) modules which contained an IC chip and a non-replaceable 10-year lithium battery. Both of these were examples of devices with pins emerging from the bottom; the construction of the RTC modules was very similar to the LED displays described below, with epoxy in a plastic shell. The RTC modules are an example of a component that could not be easily converted to surface-mount, as their size and weight with the contained battery would push the limits of mechanical strength of surface solder pads, and the thicker leads of a DIP as compared to most SMT packages were probably necessary to mechanically support the battery. Dallas also sold the same RTC chips without a battery in standard side-lead DIP packages; both versions would physically fit the same DIP sockets.

Some older equipment (circa the 1970s) used DIP terminal blocks onto the top of which discrete components could be soldered; these blocks (typically DIP16 size) would then be plugged into sockets on circuit boards and could be easily removed and swapped out, or test equipment connected between them and their sockets, for repair or testing of the machines they were a part of. These saw use mainly in industrial, commercial, and prototype equipment, not consumer electronics.

Uses


Dual in-line packages were invented at Fairchild
Fairchild Semiconductor

Present day Fairchild Semiconductor International, Inc. is a spin-off company resulting from reconstitution of assets in National Semiconductor....
 in 1965 and, by allowing integrated circuits to be packaged more densely than previous round packages did, made it possible to build complex systems such as sophisticated computers. The package was well-suited to automated assembly equipment; a printed circuit board could be populated with scores or hundreds of ICs, then have all devices soldered at once (e.g. on a wave soldering
Wave soldering

Wave soldering is a large-scale soldering process by which electronic components are soldered to a printed circuit board to form an electronic assembly....
 machine) and passed on to automated testing machines, with very little human labor required. However, the packages were still large with respect to the integrated circuits within them. By the end of the 20th century, most ICs were packaged in surface-mount
Surface-mount technology

Surface-mount technology is a method for constructing Electronics circuits in which the components are mounted directly onto the surface of printed circuit boards ....
 packages, which allowed further reduction in the size and weight of systems. DIP chips are still popular for circuit prototyping on a breadboard
Breadboard

A breadboard is a reusable sometimes solderless device used to build a prototype of an electronic circuit and for experimenting with circuit designs....
 because of how easily they can be inserted and utilized there.

DIPs were the mainstream of the microelectronics industry in the 1970s and 80s. Their use has declined in the first decade of the 21st century due to the emerging new surface-mount technology
Surface-mount technology

Surface-mount technology is a method for constructing Electronics circuits in which the components are mounted directly onto the surface of printed circuit boards ....
 (SMT) packages such as plastic leaded chip carrier
Plastic leaded chip carrier

A Plastic Leaded Chip Carrier is a four-sided Lead plastic integrated circuit package with pin spacings of 0.05" . Lead counts range from 20 to 84....
 (PLCC) and small-outline integrated circuit
Small-Outline Integrated Circuit

A small-outline integrated circuit is a Surface-mount technology integrated circuit package which occupies an area about 30 - 50% less than an equivalent dual in-line package, with a typical thickness that is 70% less....
 (SOIC), though DIPs continued in extensive use through the 1990s, and still continue to be used substantially as the year 2010 approaches. Because some modern chips are available only in surface-mount package types, a number of companies sell various prototyping adapters to allow those SMT devices to be used like DIP devices with through-hole breadboards and soldered prototyping boards (such as stripboard
Stripboard

Stripboard is a widely-used type of electronics prototyping board characterized by a 0.1 inch regular grid of holes, with wide parallel strips of copper cladding running in one direction all the way across one side of the board....
 and perfboard
Perfboard

Perfboard is a base for prototyping circuit boards. It has holes pre-drilled at set intervals across a grid, usually a square grid of 2.5mm spacing....
). (SMT can pose quite a problem, at least an inconvenience, for prototyping in general; most of the characteristics of SMT that are advantages for mass production are difficulties for prototyping.)

For programmable devices like EPROM
EPROM

An EPROM, or Erasable Programmable Read Only Memory, is a type of memory integrated circuit that retains its data when its power supply is switched off....
s and GAL
Generic array logic

The Generic Array Logic device was an innovation of the Programmable Array Logic and was invented by Lattice Semiconductor. The GAL was an improvement on the PAL because one device was able to take the place of many PAL devices or could even have functionality not covered by the original range....
s, DIPs remained popular for many years due to their easy handling with external programming circuitry (i.e., the DIP devices could be simply plugged into a socket on the programming device.) However, with In-System Programming
In-System Programming

In-System Programming is the ability of some programmable logic devices, microcontrollers, and other programmable electronic chips to be programmed while installed in a complete system, rather than requiring the chip to be programmed prior to installing it into the system....
 (ISP) technology now state of the art, this advantage of DIPs is rapidly losing importance as well. Through the 1990s, devices with pin counts below 20 were manufactured in a DIP format in addition to the newer formats. Since about 2000, newer devices are often unavailable in the DIP format, though many still are.

Mounting


DIPs can be mounted on a circuit board either directly using through-hole soldering
Through-hole technology

File:Resistors .jpgThrough-hole technology, also spelled "thru-hole", refers to the mounting scheme used for Pin-through-hole electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldering to pads on the opposite side....
 or using inexpensive spring-contact sockets. Using a DIP socket allows for easy replacement of a device and eliminates the risk of damage from overheating during soldering (as the device is inserted into the soldered socket only after it has cooled.) These are by far the most common mounting types for DIP components. DIPs can also be easily and conveniently used with standard protoboards/breadboards, whose design includes extensive consideration for them; this is a temporary mounting arrangement for circuit design development or device testing. Some hobbyists, for one-off construction or permanent prototyping, use point-to-point
Point-to-point construction

Point-to-point construction is the way most electronics circuits were constructed before the 1950s. Point-to-point construction is still used to construct prototype equipment with few or heavy electronic components....
 wiring with DIPs, and their appearance when physically inverted as part of this method inspires the informal term "dead bug style" for the method.

Construction


The body (housing) of a DIP containing an IC chip is usually made from molded plastic or ceramic in two halves, an upper and a lower half, joined and sealed at a seam. The pins emerge from the longer sides of the package along the seam, parallel to the top and bottom planes of the package, and are bent downward approximately 90 degrees (or slightly less, leaving them angled slightly outward from the centerline of the package body.) (The SOIC
SOIC

The acronym SOIC refers to:*Small-outline integrated circuit: a carrier which occupies an area about 30 - 50% less than an equivalent dual in-line package, with a typical thickness that is 70% less;...
, the SMT package that most resembles a typical DIP, appears essentially the same, notwithstanding size scale, except that after being bent down the pins are bent upward again by an equal angle to become parallel with the bottom plane of the package.) In ceramic (CERDIP) packages, an epoxy or grout is used to hermetically seal the two halves together, providing an air and moisture tight seal to protect the IC die
Die (integrated circuit)

A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon through processes such as photolithography....
 inside. Plastic DIP (PDIP) packages are usually sealed by fusing or cementing the plastic halves around the leads, but a high degree of hermeticity is not achieved because the plastic itself is usually somewhat porous to moisture and the process cannot ensure a good microscopic seal between the leads and the plastic at all points around the perimeter. However, contaminants are usually still kept out well enough that the device can operate reliably for decades with reasonable care in a controlled environment.

Inside the package, the lower half has the leads embedded, and at the center of the package is a rectangular space, chamber, or void into which the IC die is cemented. The leads of the package extend diagonally inside the package from their positions of emergence along the periphery to points along a rectangular perimeter surrounding the die, tapering as they go to become fine contacts at the die. Ultra-fine bond wires (barely visible to the naked human eye) are welded between these die periphery contacts and bond pads on the die itself, connecting one lead to each bond pad, and making the final connection between the microcircuits and the external DIP pins. The bond wires are not usually taut but loop upward slightly to allow slack for thermal expansion and contraction of the materials; if a single bond wire breaks or detaches, the entire IC may become useless. The top of the package covers all of this delicate assemblage without crushing the bond wires, protecting it from contamination by foreign materials. Semiconductor materials must be ultra pure, and doping (the controlled addition of impurities) must be very precise, to make a working device, so the slightest chemical contamination must be avoided. Usually, a company logo, alphanumeric codes and sometimes words are printed on top of the package to identify its manufacturer and type, when it was made (usually as a year and a week number), sometimes where it was made, and other proprietary information (perhaps revision numbers, manufacturing plant codes, or stepping ID codes.) (In contrast, most SMT packages, because of their micro-miniature size, bear very little printed information, usually just four- or eight-character codes identifying their functional type.)

The necessity of laying out all of the leads in a basically radial pattern in a single plane from the die perimeter to two rows on the periphery of the package is the main reason that DIP packages with higher pin counts must have wider spacing between the pin rows, and it effectively limits the number of pins which a practical DIP package may have. Even for a very small die with many bond pads (e.g. a chip with 15 inverters, requiring 32 pins), a wider DIP would still be required to accommodate the radiating leads internally. This is one of the reasons that four-sided and multiple rowed packages, such as PGAs, were introduced (around the early 1980s.)

Also, a large DIP package (such as the DIP64 used for the Motorola 68000
Motorola 68000

The Motorola 68000 is a 16/32-bit Complex instruction set computer microprocessor core designed and marketed by Freescale Semiconductor ....
 CPU) incorporates substantial lead length inside the package between the pins located toward the ends of the package and the chip die at its center, making such a package unsuitable for high-speed microarchitectures (above a few hundred megahertz), which require lead length to be kept to a minimum. The 68000 ran at no more than 20 MHz, so this was not an issue for it.

Some other types of DIP devices are built very differently. Most of these have molded plastic housings and straight pins or leads that extend directly out of the bottom of the package. For some, LED displays particularly, the housing is usually a hollow plastic box with the bottom/back open, filled (around the contained electronic components) with a hard translucent epoxy material from which the leads emerge. Others, such as DIP switches, are composed of two (or more) plastic housing parts snapped, welded, or glued together around a set of contacts and tiny mechanical parts, with the leads emerging through molded-in holes or notches in the plastic.

Variants


Nec8080
Several DIP variants for ICs exist, mostly distinguished by packaging material:
  • Ceramic Dual In-line Package (CERDIP)
  • Plastic Dual In-line Package (PDIP)
  • Shrink Plastic Dual In-line Package – A denser version of the PDIP with a 0.07 in. (1.778 mm) lead pitch.


For EPROMs, which can be erased by UV light, some DIPs, generally ceramic CERDIPs, were manufactured with a circular window of clear quartz in the center of the top of the package, over the chip die. This enabled the packaged chips to be erased by UV irradiation in an EPROM eraser. Often, the same chips were also sold in less expensive windowless PDIP or CERDIP packages as one-time programmable
EPROM

An EPROM, or Erasable Programmable Read Only Memory, is a type of memory integrated circuit that retains its data when its power supply is switched off....
 (OTP) versions. (These were actually the same erasable chips, but there was no way to get UV radiation to them to erase them.) The same windowed and windowless packages were also used for microcontrollers, and perhaps other devices, containing EPROM memory; in this context, the OTP nature of the windowless versions was sometimes a needed requirement of the customer (i.e., to prevent their end users from modifying the stored information, which might include access control bits to disable read-out of proprietary code or factory test modes which were disabled after final test qualification.) Windowed CERDIP-packaged PROMs were used for the BIOS
BIOS

In computing, the Basic Input/Output System , also known as the System BIOS, is a de facto standard defining a firmware interface for IBM PC Compatible computers....
 ROM of many early IBM PC clones (which were manufactured in limited enough quantities to make PROM an economical choice) often with a foil-backed (or regular paper) adhesive label covering the window to prevent inadvertent erasure through exposure to ambient light.

Pin count and spacing


The most common DIPs have an inter-lead spacing (lead pitch) of 0.1 in.
Inch

An inch is the name of a Units of measurement of length in a number of different systems, including Imperial units, and United States customary units....
 (2.54 mm
Metre

The metre or meter is a Unit of measurement of length. It is the SI base unit of length in the metric system and in the International System of Units , used around the world for general and scientific purposes....
) and a row spacing of either 0.3 in. (7.62 mm) or 0.6 in. (15.24 mm). In some contexts, the term DIP, especially PDIP or CERDIP, implies this spacing. The number of pins is always even; typical pin counts are 8 or from 14 to 24 (and, less commonly, 28) for 0.3 in. packages, and 24, 28, 32 or 40 (less commonly, 36, 48 or 52) for 0.6 in packages. Some 4-pin DIPs exist, e.g. containing optoisolators. Where there is a need to differentiate between the two widths for the same pin count, the term "Skinny DIP" is informally used to refer to the 0.3 in version. JEDEC
JEDEC

JEDEC Solid State Technology Association, formerly known as Joint Electron Device Engineering Council or Joint Electron Device Engineering Councils, is the semiconductor engineering standardization body of the Electronic Industries Alliance , a trade association that represents all areas of the electronics i...
 standards also specify less common packages with a row spacing of 0.4 in (10.16 mm), or 0.9 in (22.86 mm) with a pin-count of up to 64. Other standardized variants include a denser lead pitch of 0.07 in (1.778 mm) at a row spacing of 0.3 in, 0.6 in or 0.75 in. The former Soviet Union and Eastern bloc countries used similar packages, but with a metric inter-lead spacing of 2.5 mm rather than 2.54 mm (0.1 in).

The Motorola 68000
Motorola 68000

The Motorola 68000 is a 16/32-bit Complex instruction set computer microprocessor core designed and marketed by Freescale Semiconductor ....
 CPU (MC68000) was perhaps the largest common DIP IC; it was packaged in a PDIP with 64 pins on 0.1 in. centers. The MC68000 can be found in this form in the original Apple Macintosh line, early HP LaserJet-series printers, and the original, wider Sega Genesis/Megadrive game console (where the 68000 takes up as much PCB space as the two surface-mount custom Sega VLSI ASICs combined.) Motorola also used this DIP package size for some other, less popular chips, such as the MMU
Memory management unit

A memory management unit , sometimes called paged memory management unit , is a computer hardware component responsible for handling accesses to computer memory requested by the central processing unit ....
.

Orientation and pin numbering


When a DIP is viewed from the top with the in-line pin rows horizontal, the pins are sequentially numbered counterclockwise, with pin numbers increasing from left to right across the bottom edge and from right to left across the top edge. Finding any given pin is simply a matter of finding pin 1 and then counting counterclockwise. Because the dual-inline pin arrangement has radial symmetry, the layout looks the same if the package is rotated 180 degrees; therefore, to resolve this ambiguity, one end of every DIP is marked with an orientation notch, a dot, or both. The notch is centered between the pin rows and may extend all the way through the end of the package or may be just cut into the top of the end, but it is almost always present. The dot will be on top of the corner of the package at the same end as the notch, if both are present, and it will usually be a molded depression, though it may be raised or even, rarely (except for ceramic packages), merely a printed mark. When the package is viewed from the top side, pin 1 is the pin at the corner with the dot, or it is the pin counterclockwise from the notch. (That is, counterclockwise around the center of the package.) Pin 1 is always in the same inline row as pin 2.

Merely knowing that pin 1 is a corner pin on the notched or dotted end, that pins 1 and 2 are always adjacent in the same inline row of pins, and that the pin numbering is always counterclockwise is sufficient to figure out the numbers of all the pins for any DIP package. Another way to remember the numbering, also sufficient for all DIPs, is that pin 1 and the highest numbered pin are the two corner pins at the notched and/or dotted end, and that the pin numbering is counterclockwise. By either of these rule sets, if pin 1 is misidentified at the wrong corner of the marked end, it is impossible to number the pins counterclockwise with increasing numbers.

Using basic math and logic, it can be concluded that for a package with any number of pins (where is always even, of course), if pin 1 is at the lower left corner (which implies that the pin rows are horizontal), then the bottom row is numbered 1 to from left to right, and the top row is numbered to from right to left. So, for example, for a 14-pin DIP, = 14 and = 7; with the notch at the left, the bottom row pins are numbered from 1 to 7 (left to right) and the top row pins are numbered 8 to 14 (right to left). The diagram at the right above shows the DIP package rotated 90 degrees clockwise relative to this description (with pin 1 at the upper left instead of the lower left and the lines of pins vertical columns instead of horizontal rows), so the left column is numbered 1 to from top to bottom, and the right column is numbered to from bottom to top.

Some DIP devices, such as segmented LED displays, have some pin position skipped (i.e. pins omitted there.) In that case, often the existing pins will still be numbered according to the corresponding positions on a standard DIP that has no gaps in the pin rows, so the numbers of the present pins will not be contiguous. This makes it easier for experienced engineers and technicians to identify pins on these devices using their knowledge of DIP pin numbering, though it may be initially confusing for amateur hobbyists, who may expect the physical pins of every device to be numbered sequentially. This highlights an important point: when naming a package according to the number of pins, e.g. DIP14, the number should be chosen not according to the number of actual pins but according to the number of pin
positions on the package, or, in other words, according to the size of the standard DIP socket that the package will fit into. So, a 7-segment LED display with ten pins arranged in two rows 7 x 0.1 in. long and 0.3 in. apart (which leaves two missing-pin spaces on each side) would fit a DIP14 socket, but not a DIP12 or DIP10 socket, and therefore it should be identified as a DIP14; it has ten pins but 14 pin positions.

In addition to providing for human visual identification of the orientation of the package, the notch allows automated chip-insertion machinery to ensure correct orientation of the chip by mechanical sensing. A physical notch is also more durable than a printed mark, as it cannot wear off or fade, and, no less, it gains this benefit at a small savings of some material.

Descendants

The SOIC (Small Outline IC), a surface-mount package which is currently very popular (in 2009), particularly in consumer electronics and personal computers, is essentially a shrunk version of the standard IC PDIP, the fundamental difference which makes it an SMT device being a second bend in the leads to flatten them parallel to the bottom plane of the plastic housing. The SOJ (Small Outline J-lead) and other SMT packages with "SOP" (for "Small Outline Package") in their names can be considered further relatives of the DIP, their original ancestor.

Pin grid array
Pin grid array

A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging. In a PGA, the pins are arranged in a square array that may or may not cover the bottom of the package....
 (PGA) packages may be considered to have evolved from the DIP. PGAs with the same 0.1 inch pin centers as most DIPs were popular for microprocessors from the early-mid 1980s through the 1990s. Owners of personal computers containing Intel 80286 through Pentium
Pentium

Introduced on March 22, 1993, the original Pentium was the first superscalar x86 architecture microprocessor. Its fifth-generation x86 microarchitecture was a direct extension of the 80486 architecture with dual integer pipeline s, a faster FPU unit, wider data bus, and features for further reduced address calculation latency....
 processors may be most familiar with these PGA packages, which were often inserted into ZIF sockets on motherboard
Motherboard

A motherboard is the central printed circuit board in some complex electronic systems, such as modern personal computers. The motherboard is sometimes alternatively known as the mainboard, system board, or, on Apple Inc....
s. The similarity is such that a PGA socket may be physically compatible with some DIP devices, though the converse is not true.

See also

  • Single in-line package
    Single in-line package

    A single in-line package is an electronic device package which has one row of connecting pins. It is not as popular as the dual in-line package, but has been used for packaging RAM chips and multiple resistors with a common pin....
     (SIP)
  • Zig-zag in-line package
    Zig-zag in-line package

    The zig-zag in-line package or ZIP was a short-lived packaging technology for integrated circuits, particularly DRAM chips. It was intended as a replacement for Dual in-line package ....
     (ZIP)
  • Pin grid array
    Pin grid array

    A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging. In a PGA, the pins are arranged in a square array that may or may not cover the bottom of the package....
     (PGA)
  • DIP switch
    DIP switch

    A DIP switch is a set of manual Switch that are packaged in a group in a standard dual in-line package . This type of switch is designed to be used on a printed circuit board along with other electronics components and is commonly used to customize the behavior of an electronic device for specific situations....
  • QFP
    QFP

    A QFP or Quad Flat Package is an integrated circuit package with leads extending from each of the four sides. It is used primarily for Surface-mount technologying ; socketing is rare, and hole mounting is not possible....
     (Quad Flat Package)


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